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IXDD404
4 Amp Dual Low-Side Ultrafast MOSFET Driver Features
* Built using the advantages and compatibility of CMOS and IXYS HDMOSTM processes * Latch-Up Protected up to 0.5A * High Peak Output Current: 4A Peak * Wide Operating Range: 4.5V to 35V * Ability to Disable Output under Faults * High Capacitive Load Drive Capability: 1800pF in <15ns * Matched Rise And Fall Times * Low Propagation Delay Time * Low Output Impedance * Low Supply Current * Two identical drivers in single chip
General Description
The IXDD404 is comprised of two 4 Amp CMOS high speed MOSFET drivers. Each output can source and sink 4 A of peak current while producing voltage rise and fall times of less than 15ns to drive the latest IXYS MOSFETS & IGBT's. The input of the driver is compatible with TTL or CMOS and is fully immune to latch up over the entire operating range. Designed with small internal delays, cross conduction/current shootthrough is virtually eliminated in the IXDD404. Improved speed and drive capabilities are further enhanced by very low, matched rise and fall times. Additionally, each driver in the IXDD404 incorporates a unique ability to disable the output under fault conditions. When a logical low is forced into the Enable input of a driver, both of it's final output stage MOSFETs (NMOS and PMOS) are turned off. As a result, the respective output of the IXDD404 enters a tristate mode and achieves a Soft Turn-Off of the MOSFET/ IGBT when a short circuit is detected. This helps prevent damage that could occur to the MOSFET/IGBT if it were to be switched off abruptly due to a dv/dt over-voltage transient. The IXDD404 is available in the standard 8 pin P-DIP (PI), SOIC-8 (SIA) and SOIC-16 (SIA-16) packages. For enhanced thermal performance, the SOIC-8 and SOIC-16 are also available with an exposed grounded metal back package as the SI and SI-16 respectively.
Applications
* * * * * * * * * * Driving MOSFETs and IGBTs Limiting di/dt under Short Circuit Motor Controls Line Drivers Pulse Generators Local Power ON/OFF Switch Switch Mode Power Supplies (SMPS) DC to DC Converters Pulse Transformer Driver Class D Switching Amplifiers
Ordering Information
Part Number Package Type Temp. Range IXDD404PI 8-Pin PDIP IXDD404SI 8-Pin SOIC with Grounded Metal Back -55C to IXDD404SIA 8-Pin SOIC +125C IXDD404SI-16 16-Pin SOIC with Grounded Metal Back IXDD404SIA-16 16-Pin SOIC NOTE: Mounting or solder tabs on all packages are connected to ground Configuration Dual Non Inverting With Enable
Figure 1 - Functional Diagram
Vcc
200k ENA
OUTA
INB 200k ENB OUTB
GND
Copyright (c) IXYS CORPORATION 2004
DS99046B(08/04)
First Release
IXDD404 Absolute Maximum Ratings (Note 1)
Parameter Supply Voltage All Other Pins Junction Temperature Storage Temperature Lead Temperature (10 sec) Value 40 V -0.3 V to VCC + 0.3 V 150 oC -65 oC to 150 oC 300 oC
Operating Ratings
Value -55 o C to 125 o C Therm al Im pedance (Junction to Am bient) 8 Pin PDIP (PI) ( JA ) 120 o C/W 8 Pin SOIC (SIA) ( JA ) 110 o C/W 8 Pin SOIC (SI) ( JA ) with heat sink** 71 o C/W 2 Heat sink area of 1cm 16 Pin SOIC (SIA-16) ( JA ) 110 o C/W Param eter Operating Tem perature Range
Electrical Characteristics
**Heat sink area is 1 oz. copper on one side of .06" thick FR4 soldered to metal back plane.
Unless otherwise noted, TA = 25 oC, 4.5V VCC 35V . All voltage measurements with respect to GND. IXDD404 configured as described in Test Conditions. All specifications are for one channel.
Symbol VIH VIL VIN IIN VOH VOL ROH ROL IPEAK IDC VEN VENH VENL tR tF tONDLY tOFFDLY tENOH tDOLD VCC ICC REN
Parameter High input voltage Low input voltage Input voltage range Input current High output voltage Low output voltage Output resistance @ Output high Output resistance @ Output Low Peak output current Continuous output current Enable voltage range High En Input Voltage Low En Input Voltage Rise time Fall time On-time propagation delay Off-time propagation delay Enable to output high delay time Disable to output low Disable delay time Power supply voltage Power supply current
Test Conditions 4.5V VIN 18V 4.5V VIN 18V
Min 2.5
Typ
Max 0.8
Units V V V A V
-5 0V VIN VCC -10 VCC - 0.025
VCC + 0.3 10
0.025 VCC = 18V VCC = 18V VCC = 18V 2 1.5 4 1 - 0.3 2/3 Vcc 1/3 Vcc CL=1800pF Vcc=18V CL=1800pF Vcc=18V CL=1800pF Vcc=18V CL=1800pF Vcc=18V 16 13 36 35 18 17 40 39 30 30 4.5 VIN = 3.5V VIN = 0V VIN = + VCC 18 1 0 200 35 3 10 10 Vcc + 0.3 2.5 2
V A A V V V ns ns ns ns ns ns V mA A A k
Enable Pull-up Resistor
Specifications to change without notice
Note 1: Operating the device beyond parameters with listed "absolute maximum ratings" may cause permanent damage to the device. Typical values indicate conditions for which the device is intended to be functional, but do not guarantee specific performance limits. The guaranteed specifications apply only for the test conditions listed. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
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IXDD404 Electrical Characteristics
Unless otherwise noted, temperature over -55 oC to 150 oC, 4.5V VCC 35V . All voltage measurements with respect to GND. IXDD404 configured as described in Test Conditions. All specifications are for one channel.
Symbol VIH VIL VIN IIN VOH VOL ROH ROL IPEAK IDC tR tF tONDLY tOFFDLY VCC ICC
Parameter High input voltage Low input voltage Input voltage range Input current High output voltage Low output voltage Output resistance @ Output high Output resistance @ Output Low Peak output current Continuous output current Rise time Fall time On-time propagation delay Off-time propagation delay Power supply voltage Power supply current
Test Conditions
Min 2
Typ
Max 2.4
Units V V V A V
-5 0V VIN VCC -10 VCC - 0.025
VCC + 0.3 10
0.025 VCC = 18V VCC = 18V VCC = 18V 3.2 1 CL=1000pF Vcc=18V CL=1000pF Vcc=18V CL=1000pF Vcc=18V CL=1000pF Vcc=18V 4.5 VIN = 3.5V VIN = 0V VIN = + VCC 18 1 0 11 13 60 59 35 3 10 10 3.4 2
V A A ns ns ns ns V mA A A
Specifications to change without notice
3
IXDD404 Pin Configurations
1 EN A SO8 (SI) 8 PIN DIP (PI) 2 IN A 3 GND 4 IN B I X D D 4 0 4 EN B 8 OUT A 7 VCC 6 OUT B 5 SO16 (SI-16)
Pin Description
SYMBOL EN A IN A GND IN B OUT B VCC OUT A EN B FUNCTION A Channel Enable A Channel Input Ground B Channel Input B Channel Output Supply Voltage A Channel Output B Channel Enable DESCRIPTION The Channel A enable pin. This pin, when driven low, disables the A Channel, forcing a high impedance state to the A Channel Output. A Channel Input signal-TTL or CMOS compatible. The system ground pin. Internally connected to all circuitry, this pin provides ground reference for the entire chip. This pin should be connected to a low noise analog ground plane for optimum performance. B Channel Input signal-TTL or CMOS compatible. B Channel Driver output. For application purposes, this pin is connected, through a resistor, to Gate of a MOSFET/IGBT. Positive power-supply voltage input. This pin provides power to the entire chip. The range for this voltage is from 4.5V to 35V. A Channel Driver output. For application purposes, this pin is connected, through a resistor, to Gate of a MOSFET/IGBT. The Channel B enable pin. This pin, when driven low, disables the B Channel, forcing a high impedance state to the B Channel Output.
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD procedures when handling and assembling this component.
Figure 2 - Characteristics Test Diagram
VIN
4
IXDD404 Typical Performance Characteristics
Fig. 3
80 70 60
Rise Times vs. Supply Voltage
Fig. 4
80 70 60
Fall Times vs. Supply Voltage
Rise Time (ns)
Fall Times (ns)
50 40 10000pF 30 20 10 0 5 10 15 20 25 30 35 6800pF 4700pF 1800pF 1000pF 200pF
50 40 10000pF 30 6800pF 20 10 0 5 10 15 20 25 30 35 4700pF 1800pF 1000pF 200pF
Supply Voltage (V)
Supply Voltage (V)
Fig. 5
80 70 60
Rise Times vs. Load Capacitance
8V
Fig. 6
80 70 60
Fall Times vs. Load Capacitance
8V
10V
10V 12V 18V 25V 35V
Rise Time (ns)
50 18V 40 30 20 10 0 0 2000 4000 6000 8000 10000 25V 35V
Fall Time (ns)
12V
50 40 30 20 10 0 0 2000 4000 6000 8000
10000
Load Capacitance (pF)
Load Capacitance (pF)
Fig. 7
14
Rise And Fall Times vs. Temperature C L = 1000pF, V cc = 18V
Fig. 8
2.5 2.4
M ax / M in Input vs. Tem perature C L = 1000pF, V cc = 18V
12
tR
2.3
10 tF
Max / Min Input Voltage
2.2
M in Input H ig h
Time (ns)
8
2.1 2
Max Inpu t Low
6
1.9 1.8 1.7
4
2
1.6
0 -60 -10 40 90 140 190
1.5 -60 -10 40 90 140 190
Temperature (C)
Tem perature (C )
5
IXDD404
Supply Current vs. Load Capacitance Vcc = 8V
2 MHz
Fig. 9
100 90 80
Fig. 10
1000
Supply Current vs. Frequency Vcc = 8V
10000 pF 6800 pF 4700 pF 1800 pF 1000 pF 200 pF
Supply Current (mA)
100
1 MHz
70 60 50 40 30 20 10 0 100
Supply Current (ma)
10
500 kHz
1
0.1
100 kHz 50 kHz 10 kHz 1000 10000
0.01 1 10 100 1000 10000
Load Capacitance (pF)
Frequency (kHz)
Fig. 11
100 90 80
Supply Current vs. Load Capacitance Vcc = 12V
2 MHz 1 Mhz
Fig. 12
1000
Supply Current vs. Frequency Vcc = 12V
10000 pF 6800 pF 4700 pF 1800 pF 1000 pF 200 pF
Supply Current (mA)
100
70 60 50 40 30 20 10 0 100 100 kHz 50 kHz 10 kHz 1000 10000 500 kHz
Supply Current (ma)
10
1
0.1
0.01 1 10 100 1000 10000
Load Capacitance (pF)
Frequency (kHz)
Fig. 13
100 90 80
Supply Current vs. Load Capacitance Vcc = 18V
Fig. 14
1000
Supply Current vs. Frequency Vcc = 18V
10000 pF 6800 pF 4700 pF 1800 pF 1000 pF 200 pF
2 MHz
1 MHz
500 kHz
Supply Current (mA)
70 60 50 40 30 20 10 0 100 100 kHz 50 kHz 10 kHz 1000 10000
Supply Current (ma)
100
10
1
0.1
0.01 1 10 100 1000 10000
Load Capacitance (pF)
Frequency (kHz)
6
IXDD404
Supply Current vs. Load Capacitance Vcc = 35V
90 80
100
Fig. 15
100
Fig. 16
1000
Supply Current vs. Frequency Vcc = 35V
10000 pF
6800 pF 4700 pF 1800 pF 1000 pF 200 pF
Supply Current (mA)
70 60 50 40 30 20 10 0 100
2 MHz 1 MHz 500 kHz
Supply Current (mA)
10
100 kHz
1
50 kHz
0.1
10 kHz 1000 10000
0.01 1 10 100 1000 10000
Load Capacitance (pF)
Frequency (kHz)
Fig. 17
70
Propagation Delay vs. Supply Voltage CL = 1800pF Vin = 5V@1kHz
Fig. 18
50
Propagation Delay vs. Input Voltage C L = 1800pF V cc = 15V
60
45
Propagation Delay (ns)
50 tONDLY 40 tOFFDLY
Propagation Delay (ns)
tONDLY 40 tOFFDLY
tONDLY
35
30
30
20
10
25
0 5 10 15 20 25 30 35
20 2 4 6 8 10 12
Supply Voltage (V)
Fig. 20 Fig. 19
60 55 50 45
Input Voltage (V)
Propagation Delay Times vs. Temperature C L = 1000pF, V cc = 18V
Quiescent Vcc Input Current(mA)
0.3
Quiescent Supply Current vs. Temperature Vcc = 18V, Vin = 5V@1kHz, CL = 1000pF
0.25
0.2
Time (ns)
t OND LY
40 35 30 25 20 -60 -10 40 90 140 190
0.15
t OFFDLY
0.1
0.05
0 -60 -10 40 90 140 190
Temperature (C)
Temperature (C)
7
IXDD404
Fig. 21
High State Ouput Resistance vs. Supply Voltage
6
Fig. 22
6
Low State Output Resistance vs. Supply Voltage
High State Output Resistance (Ohms)
5
Low State Output Resistance (Ohms)
5
4
4
3
3
2
2
1
1
0 5 10 15 20 25 30 35
0 5 10 15 20 25 30 35
Supply Voltage (V)
Supply Voltage (V)
Fig. 23
0
Vcc vs. P Channel Output Current
Fig. 24
14
Vcc vs. N Channel Ouput Current
P Channel Output Current (A)
-2
N Channel Output Current (A)
5 10 15 20 25 30 35
12
-4
10
8
-6
6
-8
4
-10
2
-12
0 5 10 15 20 25 30 35
Vcc (V)
Vcc (V)
Fig. 25
6
P Channel Output Current vs. Temperature Vcc = 18V, CL = 1000pF
Fig. 26
6
N Channel Output Current vs. Temperature V cc = 18V C L = 1000pF
P Channel Output Current (A)
5
N Channel Output Current (A)
5
4
4
3
3
2
2
1
1
0 -80 -30 20 70 120 170
0 -80 -30 20 70 120 170
Temperature (C)
Temperature (C)
8
IXDD404
Fig. 27
20 18 16
Enable Threshold vs. Supply Voltage
Enable Threshold (V)
14 12 10 8 6 4 2 0 0 5 10 15 20 25 30 35 40
Supply Voltage (V)
Figure 28 - Typical Application Short Circuit di/dt Limit
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IXDD404 APPLICATIONS INFORMATION
Short Circuit di/dt Limit
A short circuit in a high-power MOSFET such as the IXFN100N20, (20A, 1000V), as shown in Figure 26, can cause the current through the module to flow in excess of 60A for 10s or more prior to self-destruction due to thermal runaway. For this reason, some protection circuitry is needed to turn off the MOSFET module. However, if the module is switched off too fast, there is a danger of voltage transients occuring on the drain due to Ldi/dt, (where L represents total inductance in series with drain). If these voltage transients exceed the MOSFET's voltage rating, this can cause an avalanche breakdown. The IXDD404 has the unique capability to softly switch off the high-power MOSFET module, significantly reducing these Ldi/dt transients. Thus, the IXDD404 helps to prevent device destruction from both dangers; over-current, and avalanche breakdown due to di/dt induced over-voltage transients. The IXDD404 is designed to not only provide 4A per output under normal conditions, but also to allow it's outputs to go into a high impedance state. This permits the IXDD404 output to control a separate weak pull-down circuit during detected overcurrent shutdown conditions to limit and separately control dVGS/dt gate turnoff. This circuit is shown in Figure 27. Referring to Figure 27, the protection circuitry should include a comparator, whose positive input is connected to the source of the IXFD100N20. A low pass filter should be added to the input of the comparator to eliminate any glitches in voltage caused by the inductance of the wire connecting the source resistor to ground. (Those glitches might cause false triggering of the comparator). The comparator's output should be connected to a SRFF(Set Reset Flip Flop). The flip-flop controls both the Enable signal, and the low power MOSFET gate. Please note that CMOS 4000series devices operate with a VCC range from 3 to 15 VDC, (with 18 VDC being the maximum allowable limit). A low power MOSFET, such as the 2N7000, in series with a resistor, will enable the IXFN100N20 gate voltage to drop gradually. The resistor should be chosen so that the RC time constant will be 100us, where "C" is the Miller capacitance of the IXFN100N20. For resuming normal operation, a Reset signal is needed at the SRFF's input to enable the IXDD404 again. This Reset can be generated by connecting a One Shot circuit between the IXDD408 Input signal and the SRFF restart input. The One Shot will create a pulse on the rise of the IXDD404 input, and this pulse will reset the SRFF outputs to normal operation. When a short circuit occurs, the voltage drop across the lowvalue, current-sensing resistor, (Rs=0.005 Ohm), connected between the MOSFET Source and ground, increases. This triggers the comparator at a preset level. The SRFF drives a low input into the Enable pin disabling the IXDD404 output. The SRFF also turns on the low power MOSFET, (2N7000). In this way, the high-power MOSFET module is softly turned off by the IXDD404, preventing its destruction.
+ -
Figure 29 - Application Test Diagram
Ld 10uH VB
Rd IXDD404 VCC VCCA IN EN
+ -
0.1ohm Rg OUT Rsh 1600ohm 1ohm High_Power IXFN100N20
VCC
+ -
VIN
DGND SUB Rs Low_Power 2N7002/PLP R+ 10kohm Ls 20nH
One ShotCircuit
Rcomp 5kohm NAND CD4011A Ros NOT2 CD4049A Ccomp 1pF R Cos 1pF Q
0 Comp LM339 V+ V+ C+ 100pF
+
NOT1 CD4049A
-
1Mohm
REF
-
NOT3 CD4049A EN
NOR1 CD4001A
S
NOR2 CD4001A
SR Flip-Flop
10
IXDD404
Supply Bypassing and Grounding Practices, Output Lead inductance
When designing a circuit to drive a high speed MOSFET utilizing the IXDD404, it is very important to keep certain design criteria in mind, in order to optimize performance of the driver. Particular attention needs to be paid to Supply Bypassing, Grounding, and minimizing the Output Lead Inductance. Say, for example, we are using the IXDD404 to charge a 2500pF capacitive load from 0 to 25 volts in 25ns. Using the formula: I= V C / t, where V=25V C=2500pF & t=25ns we can determine that to charge 2500pF to 25 volts in 25ns will take a constant current of 2.5A. (In reality, the charging current won't be constant, and will peak somewhere around 4A). SUPPLY BYPASSING In order for our design to turn the load on properly, the IXDD404 must be able to draw this 2.5A of current from the power supply in the 25ns. This means that there must be very low impedance between the driver and the power supply. The most common method of achieving this low impedance is to bypass the power supply at the driver with a capacitance value that is a magnitude larger than the load capacitance. Usually, this would be achieved by placing two different types of bypassing capacitors, with complementary impedance curves, very close to the driver itself. (These capacitors should be carefully selected, low inductance, low resistance, high-pulse current-service capacitors). Lead lengths may radiate at high frequency due to inductance, so care should be taken to keep the lengths of the leads between these bypass capacitors and the IXDD404 to an absolute minimum. GROUNDING In order for the design to turn the load off properly, the IXDD404 must be able to drain this 2.5A of current into an adequate grounding system. There are three paths for returning current that need to be considered: Path #1 is between the IXDD404 and it's load. Path #2 is between the IXDD404 and it's power supply. Path #3 is between the IXDD404 and whatever logic is driving it. All three of these paths should be as low in resistance and inductance as possible, and thus as short as practical. In addition, every effort should be made to keep these three ground paths distinctly separate. Otherwise, (for instance), the returning ground current from the load may develop a voltage that would have a detrimental effect on the logic line driving the IXDD404. OUTPUT LEAD INDUCTANCE Of equal importance to Supply Bypassing and Grounding are issues related to the Output Lead Inductance. Every effort should be made to keep the leads between the driver and it's load as short and wide as possible. If the driver must be placed farther than 2" from the load, then the output leads should be treated as transmission lines. In this case, a twisted-pair should be considered, and the return line of each twisted pair should be placed as close as possible to the ground pin of the
TTL to High Voltage CMOS Level Translation
The enable (EN) input to the IXDD404 is a high voltage CMOS logic level input where the EN input threshold is 1/2 VCC, and may not be compatible with 5V CMOS or TTL input levels. The IXDD404 EN input was intentionally designed for enhanced noise immunity with the high voltage CMOS logic levels. In a typical gate driver application, VCC =15V and the EN input threshold at 7.5V, a 5V CMOS logical high input applied to this typical IXDD404 application's EN input will be misinterpreted as a logical low, and may cause undesirable or unexpected results. The note below is for optional adaptation of TTL or 5V CMOS levels. The circuit in Figure 28 alleviates this potential logic level misinterpretation by translating a TTL or 5V CMOS logic input to high voltage CMOS logic levels needed by the IXDD404 EN input. From the figure, VCC is the gate driver power supply, typically set between 8V to 20V, and VDD is the logic power supply, typically between 3.3V to 5.5V. Resistors R1 and R2 form a voltage divider network so that the Q1 base is positioned at the midpoint of the expected TTL logic transition levels. A TTL or 5V CMOS logic low, VTTLLOW=~<0.8V, input applied to the Q1 emitter will drive it on. This causes the level translator output, the Q1 collector output to settle to VCESATQ1 + VTTLLOW=<~2V, which is sufficiently low to be correctly interpreted as a high voltage CMOS logic low (<1/3VCC=5V for VCC =15V given in the IXDD404 data sheet.) A TTL high, VTTLHIGH=>~2.4V, or a 5V CMOS high, V5VCMOSHIGH=~>3.5V, applied to the EN input of the circuit in Figure 28 will cause Q1 to be biased off. This results in Q1 collector being pulled up by R3 to VCC=15V, and provides a high voltage CMOS logic high output. The high voltage CMOS logical EN output applied to the IXDD404 EN input will enable it, allowing the gate driver to fully function as a 4 Amp output driver. The total component cost of the circuit in Figure 28 is less than $0.10 if purchased in quantities >1K pieces. It is recommended that the physical placement of the level translator circuit be placed close to the source of the TTL or CMOS logic circuits to maximize noise rejection.
Figure 30 - TTL to High Voltage CMOS Level Translator
CC (F rom Gate Driver P ower S upply)
10K
R 3
V DD
(F rom L ogic P ower S upply) 3.3K R 1 Q1 2N3904 3.3K R 2
HV igh oltage N CMOSE Output
(T IX o DD404 E Input) N
driver, and connect directly to the ground terminal of the load.
or T L T Input)
11
IXDD404
Dimenional Outline: IXDD404PI
Dimenional Outlines: IXDD404SI-CT and IXDD404SIA
Dimenional Outlines: IXDD404SI-16CT and IXDD404SIA-16
IXYS Corporation 3540 Bassett St; Santa Clara, CA 95054 Tel: 408-982-0700; Fax: 408-496-0670 e-mail: sales@ixys.net IXYS Semiconductor GmbH Edisonstrasse15 ; D-68623; Lampertheim Tel: +49-6206-503-0; Fax: +49-6206-503627 e-mail: marcom@ixys.de
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